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ACP
 ChipPegasus Universal Diebonder
+ Best for Flexible Production and
Development Environment
+ Extremely Powerful and Simple Software
+ Excellent Price-Perfomance Ratio
+ Very high Accuracy
The LiCONiC ChipPegasus diebonder is the new tool for development and mid-size production. With its 5 micron accuracy the ChipPegasus fulfills every need in modern microelectronic manufacturing. The new Liconic ChipPegasus diebonder software combin es a powerful production user interface. Most operations of the Windows based user interface are self explanatory.
The new Liconic ChipPegasus offers a large active working area providing room for various applications. |
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ke other flip chip machines, the bonding process can be divided into five stages: loading, alignment, placement, bonding and unloading. Each unit on the FCM bonder is designed to carry out these operations as quickly and as accurately as possible.
cleverly designed, machine. It has all the features needed to carry out successful bonding, including vertical bonding movement and placement.